Metallization Failures

Beatty, Rosemary

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Metallization Failures

1971-05-01
By Beatty, Rosemary

File Language:

English

Details

Creators:

Beatty, Rosemary
Corporate Creators:

John A. Volpe National Transportation Systems Center, (U.S.)
Corporate Contributors:

United States. National Aeronautics and Space Administration
Subject/TRT Terms:

Cold Working Integrated Circuits Metal Working
Publication/ Report Number:

DOT-TSC-NASA-71-9
Resource Type:

Tech Report
Geographical Coverage:

United States
Corporate Publisher:

United States. National Aeronautics and Space Administration
Abstract:

Metallization-related failure mechanisms are a major cause of integrated circuit failures under accelerated stress and field operations conditions.
Format:

PDF
Collection(s):

Volpe Center
Main Document Checksum:

urn:sha256:9036b4138da9fcc117815a1c9dd96b13899d736815ebecd876d36f545608ccd6
Download URL:

https://rosap.ntl.bts.gov/view/dot/38915/dot_38915_DS1.pdf
File Type:

[PDF - 2.98 MB ]

File Language:

English

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