Evaluation of Dual Cable Signal Support Systems With Pivotal Hanger Assemblies: [Summary]
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2011-01-01
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Edition:Summary Brief
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Abstract:This report presents the results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
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Content Notes:Brief has no date, but full document found on web, dated 2011.
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