Creep Shrinkage and CTE Evaluation: MoDOT's New Bridge Deck Mix Companion Testing to HPC Bridge Deck.
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2005-02-01
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Abstract:MoDOT RDT Research Project R-I00-002 “HPC for Bridge A6130 – Route 412 Pemiscot County” was recently completed in June of 2004 [Myers and Yang, 2004]. Among other research tasks, part of this research study investigated the creep, shrinkage and coefficient of thermal expansion (CTE) of Missouri’s first high performance concrete (HPC) superstructure bridge. This study examined these aforementioned properties on both the prestressed concrete (PC) girders and the cast-in-place (CIP) deck which both utilized HPC on this aforementioned project. In 2003 the Missouri Department of Transportation (MoDOT) studied nine different mix designs for possible use in bridge deck applications [MoDOT Report RI01-044, 2003]. The objective of this internal MoDOT study was to reduce the content of cementitious material to reduce shrinkage, but maintain good durability characteristics. Of the original nine mix designs, one was ultimately selected for use in an actual bridge deck application, namely, MoDOT Bridge A6671 near Waynesville, Missouri. There was interest to study how the mix design used in this bridge compared to the previous HPC deck mix design used in Bridge A6130. The objectives of this research, project study R-I00-002B, were to: 1. Determine the creep, shrinkage and CTE properties of the MoDOT Bridge A6671 deck mix. 2. Data analysis and curve fitting of the data obtained from MoDOT Bridge A6671 deck mix. 3. Compare the properties with those of the HPC Bridge A6130 (near Hayti, Missouri) deck mix to gain an understanding of the variation that may be expected in these two deck mixes. The primary difference between the two mix designs was the cementitious content. The coarse aggregate content also varied to some degree. The variation between the creep, shrinkage and coefficient of thermal expansion properties of the two mix designs are presented and discussed. The findings and conclusions of the study are also presented.
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