Evaluation of Nondestructive Tensile Testing

Details

• Creators:
  Polcari, Sam ; Bowe, Jeffrey J.
• Corporate Creators:
  John A. Volpe National Transportation Systems Center (U.S.) ; United States. National Aeronautics and Space Administration
• Subject/TRT Terms:
  • Semiconductor devices
  • Nondestructive tests
  • Chip seals
  • Tension tests
  • Chip and wire bonding
  • Maintenance and preservation
  • Testing
• Publication/ Report Number:
  DOT-TSC-NASA-71-10
• Resource Type:
  Tech Report
• Geographical Coverage:
  United States
• Edition:
  Technical Report
• Corporate Publisher:
  John A. Volpe National Transportation Systems Center (U.S.)
• Abstract:
  This report presents the results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
• Format:
  PDF
• Funding:
  NA08
• Download URL:
  https://rosap.ntl.bts.gov/view/dot/38191/dot_38191_DS1.pdf
• File Type:
  [PDF - 2.01 MB]
• Collection(s):
  Volpe Center
• Main Document Checksum:
  urn:sha-512:a5a3a5b2267aed38ba0e7dadf19bb31313e50011a777f7ff2819935000c01feb49d674ba19774fc65c07658fbc463e47e3015c205a1fd83e455ab2404463f518