This report presents the results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
The purpose of this document is to provide information to bridge owners on previous experience in conducting nondestructive testing (NDT) for a highwa...
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United States Department of Transportation
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