Evaluation of Nondestructive Tensile Testing

Polcari, Sam; Bowe, Jeffrey J.

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Evaluation of Nondestructive Tensile Testing

1971-05-01
By Polcari, Sam ; Bowe, Jeffrey J.

File Language:

English

Details

Creators:

Polcari, Sam ; Bowe, Jeffrey J.
Corporate Creators:

John A. Volpe National Transportation Systems Center (U.S.) ; United States. National Aeronautics and Space Administration
Subject/TRT Terms:

Chip And Wire Bonding Chip Seals Maintenance And Preservation Nondestructive Tests Semiconductor Devices Tension Tests Testing
Publication/ Report Number:

DOT-TSC-NASA-71-10
Resource Type:

Tech Report
Geographical Coverage:

United States
Edition:

Technical Report
Corporate Publisher:

John A. Volpe National Transportation Systems Center (U.S.)
Abstract:

This report presents the results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
Format:

PDF
Funding:

NA08
Collection(s):

Volpe Center
Main Document Checksum:

urn:sha-512:a5a3a5b2267aed38ba0e7dadf19bb31313e50011a777f7ff2819935000c01feb49d674ba19774fc65c07658fbc463e47e3015c205a1fd83e455ab2404463f518
Download URL:

https://rosap.ntl.bts.gov/view/dot/38191/dot_38191_DS1.pdf
File Type:

[PDF - 2.01 MB ]

File Language:

English

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