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Alternative Title:Wisconsin Highway Research Program. Evaluation of Interlayer Bonding in HMA Pavements
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TRIS Online Accession Number:01083345
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Edition:Final Report, 2002-2004
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Abstract:Some states, such as Wisconsin DOT have experienced pavement failures that were attributed to poor bonding at the interlayer. Three roads of WisDOT were analyzed in this study, which experienced varied degrees of slippage distress. The effect of slip can be minimized by making the surface layer sufficiently thick or stiff. It was observed that the stiffness ratio between the top two layers were higher for no distress sections than that of high distress sections. The additional thickness needed to increase structural capacity of a pavement with lower stiffness ratio to a level that will minimize slippage cracking was also investigated. The structural capacity of pavement with lower stiffness ratio (E1/E2 = 2) can be changed to the same structural capacity as that of a pavement with high E1/E2 (say, E1/E2 = 10) by providing additional thickness of 2 in and 4 in on existing top layer of 2 in and 3 in thickness, respectively. This study provides the state agency with tools during pavement design to minimize slippage cracking due to interlayer bonding failure.
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