Low Cost, Full-Field Surface Profiling Tool for Mechanical Damage Evaluation
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Low Cost, Full-Field Surface Profiling Tool for Mechanical Damage Evaluation

Filetype[PDF-1.32 MB]

  • English

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      Final Report, 09/04/09 to 03/03/10
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    • Abstract:
      In this project, Intelligent Optical Systems (IOS) developed an inexpensive, full-field, surfaceprofiling tool for mechanical damage evaluation based on the processing of a single digital image. Little operator training is required for acquiring the profile data. As shown in Figure 1-1, the tool consists of a consumer camera on a tripod with an external laser or LED line pattern illuminator. The illuminator projects a 1-D or 2-D grid of lines downward onto the damaged region. The camera images this region at an angle, so that the displacement of the line pattern over the damaged region provides a measure of the depth. A software package converts the line pattern from the camera image to a profile of the absolute depth, as measured from the undamaged pipe surface. The depth accuracy is on the order of 0.1 mm. In addition, the shape of the full pipe cross section can be extracted. The local profile of the damaged region, plus the shape of the full pipe cross section, together, provides all information required for mechanical assessment. Thus, our inexpensive, full-field approach overcomes all gaps in the assessment process that are described above. In Phase I, IOS developed detailed proof-of-principles of the proposed technology, determined precision as a function of lighting and environmental conditions, and determined preliminary software and hardware designs. These designs were evaluated for their feasibility, and techniques that will make an actual system possible for application in the harsh conditions of a pipe evaluation process were selected for further investigation and testing in Phase II. The specific goal during Phase I was to show proof of feasibility using a single line or line pair. Off-line software was used to convert the camera line image into a well-characterized 1-D profile.
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