United States Department of Transportation
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Evaluation of asphalt pavement interface conditions for enhanced bond performance.
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2017-05-01
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[PDF-16.91 MB]
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Abstract:This project describes a comprehensive modeling effort aimed at examining the potential impact of interface debonding on near-surface longitudinal cracking in the wheelpath of asphalt pavements. A critical zone defined by high shear stress coupled with low confinement was found at a depth of about 2 in and extending to 2 in from the edge of the tire, regardless of asphalt layer thickness. These critical stress states can promote a debonded strip below the wheelpath if an interface is located at an approximate depth of 2 in. The introduction of a debonded strip along the interface caused a stress redistribution that intensified shear stress ahead of the tip of the debonded zone and tensile stress immediately behind the tip (tension at this location exceeded that under the tire). A finite element parametric study based on maximum tension and maximum Von Mises stress (associated with the strain energy of distortion) identified three potential mechanisms of near-surface longitudinal cracking in an asphalt pavement with localized interface debonding: (1) bending caused by repeated traffic can initiate a crack below the edge of the debonded strip that reflects to the surface due to traffic wander and thermal cycles, especially given near-surface differential aging; (2) traffic wander can initiate a vertical crack above the edge of the debonded strip and promote upward propagation; and (3) internal tension due to partially restrained dilation can result in a crack that propagates upward through the more aged and less fracture-tolerant mixture near the surface. Future work should focus on achieving a better understanding of the mechanism of interface breakdown to prevent debonding in the first place. Identification of bonding agents more resistant to interface bond breakdown can help prevent and, in turn, mitigate the occurrence of near-surface longitudinal cracking.
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